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Thinning & DSP wafer

                     SYST can process 6-8 inch ultra flat DSP wafer, achieving a TTV ≤ 1um process level. It is an advanced enterprise with the best technology and equipment in this field in China.
                     At present, the thinnest 6-inch silicon wafer of SYST can be processed to 300um, and the thinnest 8-inch silicon wafer can be processed to 400um.