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Polished Wafers

Polished Wafers

  • Categories:产品展示
  • Time of issue:2021-05-20 08:34:52
  • Views:0
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Shenyang silicon technology company can process ultra-flat double-polished wafers of 6-8 inches, which can reach the technological level of TTV≤1um. At present, the thinnest 6-inch silicon wafer can be processed to 300um, and the thinnest 8-inch silicon wafer can be processed to 400um.

 

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