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Si-Si bond
Si-Si bond
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- Time of issue:2021-05-20 08:33:15
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When the epitaxial layer thickness is more than 50 um, the silicon-silicon bonded wafer has a better cost advantage.
For high voltage devices, such as MOSFET and IGBT is feasible alternative materials.
Good TEM and SRP test results ensure the quality of silicon-silicon bonded wafers.
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